As AI chips get larger, it becomes much harder to test them. Today, there can be as many as 22,000 pins on a 150mm² die, but in the future that number may increase to 80,000 pins. That creates a huge ...

Along with showing excellent electrical conductivity, the printed fabrics continued to perform well after 20 cycles of ...

Circuits are being pushed harder and longer, particularly with AI, speeding up the aging of data paths. Photonics adds its ...

Exploiting CPU Cache Side-Channels to Leak Tokens from Large Language Models” was published by researchers at MITRE and Worcester Polytechnic Institute. Abstract “Side-channel attacks on shared ...

A new technical paper titled “Coherent EUV scatterometry of 2D periodic structure profiles with mathematically optimal ...

A new technical paper titled “Customizing a Large Language Model for VHDL Design of High-Performance Microprocessors” was ...

Chip smuggling prevention; AI export controls and deals; OSAT revenue up; AI PC memory chipsets; big fundings and buybacks; ...

Special report on die-to-die interconnect standards; chiplet development flows; AI accelerators move out from data centers; optimizing analog; UALink; power intent; HBM4.

Chiplets will be a key enabler for customizing designs at every level, from edge devices to the cloud. AI is a key driver, ...

They depend on careful coordination between RTL, verification and implementation teams. And here’s where things get tricky. Without a consis­tent way to describe and validate power intent across the ...