Infineon and NVIDIA are working to revolutionise the power delivery architecture required for future AI data centres.

The surface-mount DFN8x8 package reduces volume by more than 90% compared to existing lead-inserted packages, such as TO-247 ...

SureCore, the memory specialist, has announced the expansion of its sureFIT design service to include AI applications.

Foxconn has also signed a strategic partnership with Thales in the satellite sector.

NXP has announced the OrangeBox 2.0, the second generation of its OrangeBox automotive-grade development platform.

Kardome’s Spatial Hearing AI technology delivers natural, seamless, and highly accurate voice user interfaces (voice UIs), ...

Archer Materials, a developer quantum technology for medical diagnostics, has signed an agreement with Paragraf.

Imec to demonstrate a highly miniaturised ingestible sensor at ITF World 2025 being held in Antwerp this week.

At the core of the CM9 Series is KIOXIA’s 8th generation BiCS FLASH, the company’s most advanced 3D flash memory to date.

Siemens Cre8Ventures has announced a new partnership with Xiphera, a provider of hardware-based cryptographic solutions, ...

Microchip Technology has developed MEC175xB embedded controllers with embedded immutable quantum cryptography support.

The nature and quality of modern sensors have improved to the point where they are being used to create a new category of ...