Along with showing excellent electrical conductivity, the printed fabrics continued to perform well after 20 cycles of ...

Circuits are being pushed harder and longer, particularly with AI, speeding up the aging of data paths. Photonics adds its ...

As AI chips get larger, it becomes much harder to test them. Today, there can be as many as 22,000 pins on a 150mm² die, but in the future that number may increase to 80,000 pins. That creates a huge ...

A new technical paper titled “Coherent EUV scatterometry of 2D periodic structure profiles with mathematically optimal ...

A new technical paper titled “Customizing a Large Language Model for VHDL Design of High-Performance Microprocessors” was ...

AI export rule to be scrapped; SEMI, EU request; Cadence, Nvidia supercomputer; AI co-processor; Imagination's new GPU; semi sales up; imec, TNO photonics lab; NSF key to national security; flexible ...

Two standards — Bunch of Wires (BoW) and UCIe — compete with proprietary designs. Today, the latter predominates, since ...

Chiplets offer a huge leap in semiconductor functionality and productivity, just like soft IP did 40 years ago, but a lot has ...

Chiplets will be a key enabler for customizing designs at every level, from edge devices to the cloud. AI is a key driver, ...

Exploiting CPU Cache Side-Channels to Leak Tokens from Large Language Models” was published by researchers at MITRE and Worcester Polytechnic Institute. Abstract “Side-channel attacks on shared ...

Supply chain vulnerabilities, hardware attacks, and communications hacks are rife. Autonomous technology poses extra threats.

Rooting out the causes of silent data corruption errors will require testing improvements and much more. Silent data errors ...